宝工
10
1+ 面议
SD
855
1+ 面议
供应SD卡座连接器 SD卡座垫高1.8 外焊SD卡座垫高1.8 外焊 优势
卡座
MATERIAL:Insulator:LCP/ThermalPlastic,UL94V-0Contacts:PhosphorBronze/CopperAlloyShell:StainlessSteelGrounding:BrassCONTACTPLATING:Underplate:50μ”~100μ”NickelContactArea:1μ”~30μ”SelectiveGoldSolderTailsArea:100μ”Tin/Lead(BrightenTin)or100μ”~200μ”Tin/LeadFree(BrightenTin/MatteTin)ELECTRICAL:OperationVoltage:3.3VACMax.CurrentRating:0.5AContactResistance:1000OHMSMax.InsulationResistance:1000ohmsmin@500VDC.DielectricWithstandingVoltage:1000VAC/minuteOperatingTemperature:-20°Cto+85°CMatingCycles:10000Cycles,Springisnotbreaking
会员年限:20年
5000
1+ 面议
PEAK
7862
1+ ¥1000002.00
XSENS
200
1+ ¥16000.00